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datashee t product structure silicon monolithic integrated circuit this product has not designed prot ection against radioactive rays . 1/15 tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 tsz22111 ? 14? 001 www.rohm.com voltage detectors voltage detector ics with watchdog timer bd37axx series bd87axx series bd99a41f general description the bd37a19fvm, bd37a41fvm, bd87a28fvm, bd87a29fvm, bd87a34fvm, bd87a41fvm and bd99a41f are watchdog timer reset ics. it delivers a high precision detection voltage of ? 1.5% and a super-low current consumption of 5 a (typ.). it can be used in a wide range of electronic devices to monitor power supply voltages and in system operation to prevent runaway operation. features ? built-in watchdog timer ? reset delay time can be set with the ct pin's external capacitance ? watchdog timer monitor time and reset time can be set with the ctw pin's external capacitance. ? output circuit type: n-channel open drain applications all devices using microcontrollers or dsp, including vehicle equipment, displays, servers, dvd players, and telephone systems key specifications ? reset power supply voltage range: 1.0v to 10v ? wdt power supply voltage range: 2.5v to 10v ? high precision detection voltage: (ta = 25 ) ? 1.5% (ta = ? 40 to 105 ) ? 2.5% ? super-low current consumption: 5 a(typ.) ? operating temperature range: -40 to +105 packages w (typ.) x d (typ.) x h (max.) ? msop8 2.90mm x 4.00mm x 0.90mm ? sop8 5.00mm x 6.20mm x 1.71mm ordering information b d 3 7 a 1 9 f v m - t r part number 37a wdt h active 87a wdt l active 99a wdt h active detection voltage 19 1.9v 28 2.8v 29 2.9v 34 3.4v 41 4.1v package fvm : msop8 f : sop8 packaging and forming specification tr: embossed tape and reel e2: embossed tape and reel lineup detection voltage (typ.) inh logic package orderable part number 1.9v h: active msop8 reel of 3000 bd37a19fvm-tr 4.1v h: active msop8 reel of 3000 bd37a41fvm-tr 2.8v l: active msop8 reel of 3000 BD87A28FVM-TR 2.9v l: active msop8 reel of 3000 bd87a29fvm-tr 3.4v l: active msop8 reel of 3000 bd87a34fvm-tr 4.1v l: active msop8 reel of 3000 bd87a41fvm-tr 4.1v h: active sop8 reel of 2500 bd99a41f-e2
2/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 pin configurations figure 1. pin configurations pin descriptions bd37axxfvm bd87axxfvm / bd99a41f no. pin name function no. pin name function 1 clk clock input from microcontroller 1 ctw wdt time setting capacitor connection pin 2 ct reset delay time setting capacitor connection pin 2 ct reset delay time setting capacitor connection pin 3 ctw wdt time setting capacitor connection pin 3 clk clock input from microcontroller 4 vdd power supply pin 4 gnd gnd pin 5 n.c. nc pin 5 vdd power supply pin 6 gnd gnd pin 6 inh wdt on / off setting pin inh=h/l:wdt=off/on(bd87axxfvm) inh=h/l:wdt=on/off(bd99a41f) 7 inh wdt on/off setting pin inh=h/l:wdt=on/off 7 n.c. nc pin 8 reset reset output pin 8 reset reset output pin block diagrams bd37axxfvm bd87axxfvm / bd99a41f ct pin capacitor: 470pf to 3.3f ctw pin capacitor: 0.001f to 10f figure 2.block diagrams msop8 ( top view ) 1 2 3 4 8 7 6 5 sop8 ( top view ) 1234 8765 reset inh vref vdd gnd n.c. vdd vthh vthl r s q r s q + + + clk ct ctw vdd 1 2 3 4 8 7 6 5 pulse generation circuit pulse generation circuit ctw ct clk gnd reset n.c. vref vdd inh vdd vdd vthh vthl r s q r s q 1 2 3 4 5 6 7 8 + + +
3/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings (ta=25 ) parameter symbol ratings unit power supply voltage *1 vdd ? 0.3 to 10 v ct pin voltage vct ? 0.3 to vdd + 0.3 v ctw pin voltage vctw ? 0.3 to vdd + 0.3 v reset pin voltage vreset ? 0.3 to vdd + 0.3 v inh pin voltage vinh ? 0.3 to vdd + 0.3 v clk pin voltage vclk ? 0.3 to vdd + 0.3 v power dissipation pd 470 *2 mw 550 *3 operating ambient temperature topr ? 40 to + 105 storage temperature ts t g ? 55 to + 125 maximum junction temperature tjmax 125 *1 do not exceed pd. *2 msop8 : reduced by 4.70 mw/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). *3 sop8 : reduced by 5.50 mw/ over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). recommended operating ratings (ta = ? 40 to 105 ) parameter symbol min. max. unit reset power supply voltage vdd reset 1.0 10 v wdt power supply voltage vdd wdt 2.5 10 v electrical characteristics (unless otherwise specified, ta = ? 40 to 105 , vdd = 5v) parameter symbol limits unit conditions min. typ. max. [overall] total supply current 1 (during wdt operation) idd1 ? 5 14 a inh : wdt on logic input ctw = 0.1f total supply current 2 (when wdt stopped) idd2 ? 5 14 a inh : wdt off logic input output leak current ileak ? ? 1 a vdd = vds = 10v output current capacity iol 0.7 ? ? ma vdd = 1.2v, vds = 0.5v [reset] detection voltage 1 1.9v detect vdet1 1.871 1.900 1.929 v ta = 2 5 2.8v detect vdet1 2.758 2.800 2.842 v ta = 2 5 2.9v detect vdet1 2.886 2.930 2.974 v ta = 2 5 3.4v detect vdet1 3.349 3.400 3.451 v ta = 2 5 4.1v detect vdet1 4.039 4.100 4.162 v ta = 2 5 detection voltage 2 1.9v detect vdet2 1.852 1.900 1.948 v ta = ? 40 to 105 2.8v detect vdet2 2.730 2.800 2.870 v ta = ? 40 to 105 2.9v detect vdet2 2.857 2.930 3.003 v ta = ? 40 to 105 3.4v detect vdet2 3.315 3.400 3.485 v ta = ? 40 to 105 4.1v detect vdet2 4.007 4.100 4.202 v ta = ? 40 to 105 hysteresis width 1.9v detect vrhys vdet0.03 vdet0.13 vdet0.19 v ta = ? 40105 2.8v detect vrhys vdet0.018 vdet0.045 vdet0.060 v ta= ? 40105 2.9v detect vrhys vdet0.02 vdet0.05 vdet0.06 v ta = ? 40105 3.4v detect vrhys vdet0.02 vdet0.05 vdet0.07 v ta= ? 40105 4.1v detect vrhys vdet0.018 vdet0.035 vdet0.050 v ta = ? 40105
4/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 electrical characteristics - continued (unless otherwise specified, ta = ? 40 to 105 , vdd = 5v) parameter symbol limits unit conditions min. typ. max. reset transmission delay time: low ? high tplh 3.9 6.9 10.1 ms ct = 0.001f *1 when vdd = vdet ? 0.5v delay circuit resistance rrst 5.8 10.0 14.5 m ? vct = gnd delay pin threshold voltage vcth vdd0.3 vdd0.45 vdd0.6 v rl = 470k ? delay pin output current ict 150 ? ? a vdd = 1.50v, vct = 0.5v min. operating voltage vopl 1.0 ? ? v vol 0.4v, rl = 470k ? [wdt] wdt monitor time twh 7.0 10.0 20.0 ms ctw = 0.01f *2 wdt reset time twl 2.4 3.3 7.0 ms ctw = 0.01f *3 clock input pulse width twclk 500 ? ? ns clk high threshold voltage vclkh vdd 0.8 ? vdd v clk low threshold voltage vclkl 0 ? vdd 0.3 v inh high threshold voltage vinhh vdd 0.8 ? vdd v inh low threshold voltage vinhl 0 ? vdd 0.3 v ctw charge current ictwc 0.25 0.50 0.75 a vctw = 0.2v ctw discharge current ictwo 0.75 1.50 2.00 a vctw = 0.8v *1 tplh can be varied by changing the ct capacitance value. tplh (s) ? 0.69 rrst (m ? ) ct (f) rrst = 10 m ? (typ.) *2 twh can be varied by changing the ctw capacitance value. twh (s) ? (0.5 ctw (f))/ictwc (a) ictwc = 0.5 a (typ.) *3 twl can be varied by changing the ctw capacitance value. twl (s) ? (0.5 ctw (f))/ictwo (a) ictwo = 1.5 a (typ.)
5/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 0 2 4 6 8 10 0246810 supply voltage: vdd [v] circuit current: idd [ a ] 0 50 100 150 200 250 300 350 400 012345 supply voltage: vdd [v] ct pin current: ict [ a] . typical performance curves (unless otherwise specified, ta = 25 ) : 4.1v detection figure 4. total supply current figure 5. delay pin current vs power supply voltage figure 6. ctw charge discharge current figure 3. detection voltage ta = 2 5 ta = - 4 0 ta=105 -1 -0.5 0 0.5 1 1.5 2 012345 ctw pin voltage: vctw [v] ctw pin current: ictw [a] 0 2 4 6 8 10 12 0246810 supply voltage: vdd [v] reset voltage: vreset [v] .
6/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 0 0.5 1 1.5 2 0246810 reset voltage: vreset [v] reset current: ireset [ma] 1 10 100 1000 10000 0.0001 0.001 0.01 0.1 ct pin capacity: ct [f] output delay time: tplh [ms] . 0.1 1 10 100 1000 10000 0.001 0.01 0.1 1 10 ctw pin capacity: ctw [v] wdt reset time: tw [ms] 3.5 3.75 4 4.25 4.5 4.75 5 -40 0 40 80 ambient temperature: ta [ ] detection voltage: vdet [v] typical performance curves ? continued (unless otherwise specified, ta = 25 ) : 4.1v detection figure 8. t reset transmission delay time vs capacitance figure 9. wdt time vs capacitance figure 10. detection voltage vs temperature figure 7. output current ta = 2 5 ta = - 4 0 ta=105 monite r time reset time l h h l
7/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 0 0.25 0.5 0.75 1 -40 0 40 80 ambient temperature: ta [ ] operating voltage: vopl [v] 8 9 10 11 12 13 -40 0 40 80 ambient temperature: ta [ ] output delay resistance: rrst [m] 5 6 7 8 9 10 -40 0 40 80 ambient temperature: ta [ ] output delay time: tplh [ms] 0 3 6 9 12 15 -40 0 40 80 ambient temperature: ta [ ] wdt reset time: tw [ms] typical performance curves ? continued (unless otherwise specified, ta = 25 ) : 4.1v detection figure 12. ct pin circuit resistance vs temperature figure 13. reset transmission delay time vs temperature figure 14. wdt time vs temperature figure 11. operating marginal voltage vs temperature
8/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 timing chart figure 15. timing chart explanation the reset pin voltage (reset) switches to low when the power supply voltage (vdd) falls to 0.8 v. the external capacitor connected to the ct pin begins to charge when vdd rises above the reset detection voltage (vdeth). the reset signal stays low until vdd reaches t he vdeth voltage and switches to high when vdd reaches or exceeds the vdeth voltage. the reset transmission dela y time tplh allowed to el apse before reset switches from low to high is given by the following equation: tplh (s) ? 0.69 rrst ct (f) ? ? [1] rrst denotes the ic's built-in resi stance and is designed to be 10 m ? (typ.). ct denotes the external capacitor connected to the ct pin. the external capacitor connected to the ctw pin begins to charge when reset rises, triggering the watchdog timer. the ctw pin state switches from charge to discharge when the ctw pin voltage (vctw) reaches vthh, and reset switches from high to low. the watchdog timer monitor time twh is given by the following equation: twh (s) ? (0.5 ctw (f))/(ictwc) ? ? [2] ictwc denotes the ctw charge current and is designed to be 0.50 a (typ.). ctw denotes the external capacitor connected to the ctw pin. the ctw pin state switches from charge to discharge when vctw reaches vthl, and reset switches from low to high. the watchdog timer reset time twl is given by the following equation: twl (s) ? (0.5 ctw (f))/(ictwo) ? ? [3] ictwo denotes the ctw discharge current and is designed to be 1.50 a (typ.). the ctw pin state may not switch from charge to disc harge when the clk input pulse width twclk is short. use a twclk input pulse width of at least 500 ns. twclk 500 ns (min.) when a pulse (positive edge trigger) of at least 500 ns is input to the clk pin while the ctw pin is charging, the ctw state switches from charge to discharge. once it discharges to vthl, it will charge again. watchdog timer operation is forced off when the inh pin switches to low (l: bd37axx series. bd99a41f, h: bd87axxseries). at that time, only the watchdog timer is turned off. reset detection is performed normally. the watchdog timer function turns on when the inh pi n switches to high(h: bd37axx series. bd99a41f, l: bd87axxseries). the external capacitor connected to the ctw pin begins to charge at that time. reset switches from high to low when vdd falls to the reset detection volt age (vdet) or lower. ? when vdd falls to 0 v, the reset signal stays low until vdd reaches 0.8 v. *2 (bd37axxfvm bd99a41f) ? inh vctw clk reset 0 0 0 0 0 wdt circuit turns off when inh is high twclk *4 twclk vthh vthl *1 tplh *3 twl twh vct vcth inh vdd vdeth vdet wdt circuit turns off when inh is low 0 0 vdeth=vdet+vrhys (bd87axxfvm)
9/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 power dissipation msop8 sop8 figure 16. power dissipation i/o equivalence circuit clk inh ct ctw reset figure 17. i/o equivalence circuit ambient temperature: ta [ ] 0 400 200 25 50 75 125 100 0 power dissipation: pd [mw] 600 470mw 800 105 when mount ed on a glass epoxy board (70 mm ? 70 mm ? 1.6mm) ? ja = 212.8 (c /w) ambient temperature: ta [ ] 0 400 200 25 50 75 125 100 0 power dissipation: pd [mw] 600 550mw 800 105 when mounted on a glass epoxy board (70 mm ? 70 mm ? 1.6mm) ? ja = 181.8 (c /w) reset ct w vdd vdd cl k vdd inh vdd ct 10m (typ.) vdd vdd
10/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 external settings for pins and precautions 1) connect a capacitor (0.001 f to 1,000 f) between the vdd and gnd pins when the power line impedance is high. use of the ic when the power line impedance is high may result in oscillation. 2) external capacitance a capacitor must be connected to the ctw pin. when using a large capacitor such as 1 f, the inh pin must allow a ctw discharge time of at least 2 ms. the power-on reset time is given by equation [1] on page 8. the wdt time is given by equations [2] and [3] on page 8. the setting times are proporti onal to the capacitance value from the equations, so the maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance. note however that the electrical characteristics do not incl ude the external capacitor's temperature characteristics. operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. 2) gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pi ns are shorted together. 5) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 7) regarding input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction op erates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. gnd n p n n p+ p+ parasitic element or transistor p substrate (pin b) c b e transistor (npn) parasitic element (pin a) gnd n p n n p+ p+ resistor p parasitic element (pin a) parasitic element or transistor (pin b) gnd c b e figure 18. example of ic structure
11/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 8) ground wiring pattern when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 9) applications or inspection processes with modes where the potentials of the vdd pin and other pins may be reversed from their normal states may cause damage to the ic?s intern al circuitry or elements. use an output pin capacitance of 1000 f or lower in case vdd is shorted with the gnd pin wh ile the external capacitor is charged. it is recommended to insert a diode for preventing back current flow in series with vdd or bypass diodes between vcc and each pin. figure 19. 10) when vdd falls below the operating marginal voltage, ou tput will be open. when output is being pulled up to input, output will be equivalent to vdd. 11) input pin the clk and inh pins comprise inverter gates and should not be left open. (these pins should be either pulled up or down.) input to the clk pin is detect ed using a positive edge trigger and does not affect the clk signal duty. input the trigger to the clk pin within the twh time. bypass diode vdd back current prevention diode pin
12/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
13/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information ? continued package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
14/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 marking diagrams part number marking package part number d3719 msop8 reel of 3000 bd37a19fvm-tr d3741 msop8 reel of 3000 bd37a41fvm-tr d8728 msop8 reel of 3000 BD87A28FVM-TR d8729 msop8 reel of 3000 bd87a29fvm-tr d8734 msop8 reel of 3000 bd87a34fvm-tr d8741 msop8 reel of 3000 bd87a41fvm-tr 99a41 sop8 reel of 2500 bd99a41f-e2 sop8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark
15/15 bd37axx series bd87axx series bd99a41f datasheet tsz02201-0t2t0an00130-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.apr.2013 rev.002 www.rohm.com tsz22111 ? 15? 001 revision history date revision changes 12.apr.2013 001 new release 25.apr.2013 002 p.8 explanation modified. p.9 figure 17. i/o equivalence circuit the error in writing of the part of clk was corrected.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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